JPS6314056B2 - - Google Patents

Info

Publication number
JPS6314056B2
JPS6314056B2 JP57006061A JP606182A JPS6314056B2 JP S6314056 B2 JPS6314056 B2 JP S6314056B2 JP 57006061 A JP57006061 A JP 57006061A JP 606182 A JP606182 A JP 606182A JP S6314056 B2 JPS6314056 B2 JP S6314056B2
Authority
JP
Japan
Prior art keywords
weight
alloy
copper
strength
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57006061A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58124254A (ja
Inventor
Masahiro Tsuji
Michiharu Yamamoto
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Priority to JP606182A priority Critical patent/JPS58124254A/ja
Publication of JPS58124254A publication Critical patent/JPS58124254A/ja
Publication of JPS6314056B2 publication Critical patent/JPS6314056B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
JP606182A 1982-01-20 1982-01-20 半導体機器のリ−ド材用銅合金 Granted JPS58124254A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP606182A JPS58124254A (ja) 1982-01-20 1982-01-20 半導体機器のリ−ド材用銅合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP606182A JPS58124254A (ja) 1982-01-20 1982-01-20 半導体機器のリ−ド材用銅合金

Related Child Applications (5)

Application Number Title Priority Date Filing Date
JP23369983A Division JPS59145746A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金
JP23370083A Division JPS59145747A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金
JP23370183A Division JPS59145748A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金
JP23369883A Division JPS59145745A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金
JP23370283A Division JPS59145749A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金

Publications (2)

Publication Number Publication Date
JPS58124254A JPS58124254A (ja) 1983-07-23
JPS6314056B2 true JPS6314056B2 (en]) 1988-03-29

Family

ID=11628069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP606182A Granted JPS58124254A (ja) 1982-01-20 1982-01-20 半導体機器のリ−ド材用銅合金

Country Status (1)

Country Link
JP (1) JPS58124254A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007100145A (ja) * 2005-09-30 2007-04-19 Dowa Holdings Co Ltd 曲げ加工性と疲労特性を改善した銅合金板材

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5949293B2 (ja) * 1982-06-05 1984-12-01 株式会社神戸製鋼所 電気電子部品用銅合金及びその製造法
JPS59136439A (ja) * 1983-01-26 1984-08-06 Sanpo Shindo Kogyo Kk 銅基合金
JPS6043448A (ja) * 1983-08-16 1985-03-08 Kobe Steel Ltd 端子・コネクター用銅合金の製造方法
JPS60218442A (ja) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS60218440A (ja) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS61177348A (ja) * 1985-02-01 1986-08-09 Kobe Steel Ltd セラミツクパツケ−ジｉｃ用リ−ド材
US4650123A (en) * 1986-03-25 1987-03-17 Toyota Jidosha Kabushiki Kaisha Rotary type electrostatic spray painting device
US4700896A (en) * 1986-04-11 1987-10-20 Toyota Jidosha Kabushiki Kaisha Rotary type electrostatic spray painting device
KR940010455B1 (ko) * 1992-09-24 1994-10-22 김영길 고강도, 우수한 전기전도도 및 열적안정성을 갖는 동(Cu)합금 및 그 제조방법
KR0157257B1 (ko) * 1995-12-08 1998-11-16 정훈보 석출물 성장 억제형 고강도, 고전도성 동합금 및 그 제조방법
JP4542008B2 (ja) * 2005-06-07 2010-09-08 株式会社神戸製鋼所 表示デバイス
US7782413B2 (en) 2007-05-09 2010-08-24 Tohoku University Liquid crystal display device and manufacturing method therefor
JP5121299B2 (ja) * 2007-05-09 2013-01-16 アルティアム サービシズ リミテッド エルエルシー 液晶表示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6012421B2 (ja) * 1976-07-28 1985-04-01 株式会社東芝 リ−ド線材の製造方法
JPS55104449A (en) * 1979-02-02 1980-08-09 Hitachi Ltd High-strength high-electrically-conductive copper alloy with superior weldability
US4191601A (en) * 1979-02-12 1980-03-04 Ampco-Pittsburgh Corporation Copper-nickel-silicon-chromium alloy having improved electrical conductivity
EP0018818A1 (en) * 1979-04-30 1980-11-12 Enfield Rolling Mills Limited Precipitation hardening copper alloys
JPS56142840A (en) * 1980-04-04 1981-11-07 Hitachi Ltd Copper alloy having minute crystal grain
JPS5834536B2 (ja) * 1980-06-06 1983-07-27 日本鉱業株式会社 半導体機器のリ−ド材用の銅合金

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007100145A (ja) * 2005-09-30 2007-04-19 Dowa Holdings Co Ltd 曲げ加工性と疲労特性を改善した銅合金板材

Also Published As

Publication number Publication date
JPS58124254A (ja) 1983-07-23

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